Microwave assisted low temperature encapsulation of Ag films by Cu reactions using Ag-Cu alloy structures

Engineering & Materials Science

• Encapsulation 100%
• Rutherford backscattering spectroscopy 81%
• Microwaves 77%
• Copper oxides 63%
• Flexible electronics 61%
• Spectrometry 57%
• Annealing 43%
• X ray diffraction 43%
• Thin films 41%
• Oxides 37%
• Copper 35%
• Temperature 35%

Chemical Compounds

• Encapsulation 76%
• Microwave 71%
• Alloy 61%
• Rutherford Backscattering Spectroscopy 56%
• Copper Oxide 48%
• Liquid Film 42%
• Annealing 34%
• Probe 26%
• Oxide 23%
• X-Ray Diffraction 21%

Physics & Astronomy

• microwaves 59%
• copper oxides 51%
• backscattering 39%
• copper 31%
• electrical resistivity 27%
• oxides 27%
• cavities 27%
• probes 26%
• annealing 26%
• diffraction 23%
• spectroscopy 23%
• electronics 22%
• thin films 22%
• x rays 19%
• temperature 13%