Interlayer Engineering to Achieve <1 m2K/GW Thermal Boundary Resistances to Diamond for Effective Device Cooling

K. Woo, M. Malakoutian, Y. Jo, X. Zheng, T. Pfeifer, R. Mandia, T. Hwang, H. Aller, D. Field, A. Kasperovich, D. Saraswat, D. Smith, P. Hopkins, S. Graham, M. Kuball, K. Cho, Srabanti Chowdhury

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science