Heterogeneous silicon integration by ultra-high vacuum wafer bonding

Engineering & Materials Science

• Ultrahigh vacuum 100%
• Wafer bonding 90%
• Plasma applications 50%
• Silicon 50%
• Substrates 44%
• Surface chemistry 41%
• Electron microscopy 41%
• Atomic force microscopy 40%
• Surface morphology 35%
• Spectroscopy 35%
• Thin films 30%

Physics & Astronomy

• ultrahigh vacuum 63%
• wafers 47%
• silicon 34%
• chemistry 21%
• integrity 13%
• Auger spectroscopy 12%
• flexibility 11%
• electron microscopy 10%
• atomic force microscopy 9%
• insulators 9%
• preparation 9%
• high resolution 7%
• predictions 6%
• thin films 6%

Chemical Compounds

• Vacuum 50%
• Surface Chemistry 29%
• Flexibility 25%
• Atomic Force Microscopy 25%
• Spectroscopy 20%
• Plasma 19%
• Chemistry 18%
• Surface 10%