Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation

X. Deng, M. Koopman, Nikhilesh Chawla, K. K. Chawla

Research output: Contribution to journalArticlepeer-review

160 Scopus citations


Reflow of Sn-rich solders on a Cu substrate results in the formation of several Cu-Sn and Ag-Sn intermetallics, which control the properties of the solder joint. Bulk measurement of physical properties, such as Young's modulus, is problematic and may be affected by porosity and undesired phases. In this paper, we report on the accurate and reliable Young's modulus values of Cu6Sn5, Cu3Sn, and Ag3Sn intermetallics, measured in situ in a solder joint by nanoindentation. The measured values for Cu6Sn5, Cu3Sn, and Ag3Sn, were 112.3 ± 5.0, 134.2 ± 6.7, and 78.9 ± 3.7 GPa, respectively. Comparison of these values with limited data in the literature was also conducted and is discussed.

Original languageEnglish (US)
Pages (from-to)240-243
Number of pages4
JournalMaterials Science and Engineering A
Issue number1-2
StatePublished - Jan 15 2004


  • Intermetallic
  • Nanoindentation
  • Solder
  • Young's modulus

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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