Use of Ag-Al Alloy Films to Improve the Thermal Stability for Ag Metallization

Terry Alford

Use of Ag-Al Alloy Films to Improve the Thermal Stability for Ag Metallization

Arizona State University

Research output: Patent

Abstract

ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.

Original language	English (US)
State	Published - Jun 25 2003

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title = "Use of Ag-Al Alloy Films to Improve the Thermal Stability for Ag Metallization",

abstract = "ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.",

author = "Terry Alford",

year = "2003",

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day = "25",

language = "English (US)",

type = "Patent",

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AU - Alford, Terry

PY - 2003/6/25

Y1 - 2003/6/25

N2 - ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.

AB - ASU researchers have developed semiconductor devices and methods for making the same which incorporate thin films of Ag-Al alloy. These films do not exhibit the thermal agglomeration problems which have plagued Ag metallization in the past. This invention thus allows the performance advantages of silver to be effectively captured for metallization in TFT devices, in flexible electronics using polymers, and in high-speed electronics.

M3 - Patent

ER -

Use of Ag-Al Alloy Films to Improve the Thermal Stability for Ag Metallization

Abstract

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