TY - GEN
T1 - Understanding metal oxide RRAM current overshoot and reliability using Kinetic Monte Carlo simulation
AU - Yu, Shimeng
AU - Guan, Ximeng
AU - Wong, H. S.Philip
PY - 2012/12/1
Y1 - 2012/12/1
N2 - A Kinetic Monte Carlo (KMC) numerical simulator is developed for metal oxide resistive random access memory (RRAM). In this work, substantial improvements are made on the stochastic model in [1] by including multiple conduction mechanisms, local field and local temperature profile, and tracking of the individual oxygen migration path. The improved simulator shows extended capability to study a full set of RRAM characteristics such as set/forming current overshoot, endurance, and retention, etc. The simulations suggest that 1) eliminating the forming process and decreasing the parasitic capacitance is required for minimizing the overshoot effect and reducing the reset power consumption; 2) the degradation of endurance can be explained by oxygen escaping from the electrode during cycling; 3) the oxygen migration barrier can be extracted from the retention baking test over a suitable temperature range.
AB - A Kinetic Monte Carlo (KMC) numerical simulator is developed for metal oxide resistive random access memory (RRAM). In this work, substantial improvements are made on the stochastic model in [1] by including multiple conduction mechanisms, local field and local temperature profile, and tracking of the individual oxygen migration path. The improved simulator shows extended capability to study a full set of RRAM characteristics such as set/forming current overshoot, endurance, and retention, etc. The simulations suggest that 1) eliminating the forming process and decreasing the parasitic capacitance is required for minimizing the overshoot effect and reducing the reset power consumption; 2) the degradation of endurance can be explained by oxygen escaping from the electrode during cycling; 3) the oxygen migration barrier can be extracted from the retention baking test over a suitable temperature range.
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U2 - 10.1109/IEDM.2012.6479105
DO - 10.1109/IEDM.2012.6479105
M3 - Conference contribution
AN - SCOPUS:84876112500
SN - 9781467348706
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 26.1.1-26.1.4
BT - 2012 IEEE International Electron Devices Meeting, IEDM 2012
T2 - 2012 IEEE International Electron Devices Meeting, IEDM 2012
Y2 - 10 December 2012 through 13 December 2012
ER -