TY - GEN
T1 - Ultrasonic guided wave inspection and characterization of integrated circuit packages with delamination
AU - Ikram, Javaid
AU - Li, Guoyi
AU - Neerukatti, Rajesh K.
AU - Chattopadhyay, Aditi
PY - 2017
Y1 - 2017
N2 - Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.
AB - Adhesive failure in an integrated circuit (IC) package occurs due to certain loading conditions or manufacturing induced defects such as the presence of residual moisture, foreign material or insufficient copper roughening, causing delamination between the layers and subsequent failure of the IC package. In this paper, the use of ultrasonic guided wave based nondestructive evaluation (NDE) technique is investigated to detect delamination in a large form factor IC package. Piezoelectric transducers are used as actuators and sensors and the signals obtained from controlled damaged specimens is analyzed to understand the effect of delamination on the guided wave propagation behavior. Matching pursuit decomposition (MPD), an advanced time-frequency based signal processing algorithm, is used to extract the associated guided wave features such as mode conversions due to delamination. The information is used to characterize features such as relative amplitude of the modes and time of flight. These results will be used to develop a robust damage detection framework for the rapid inspection and quality assurance of IC packages using a non-invasive NDE procedure.
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U2 - 10.12783/shm2017/14126
DO - 10.12783/shm2017/14126
M3 - Conference contribution
AN - SCOPUS:85032373940
T3 - Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring, IWSHM 2017
SP - 2320
EP - 2326
BT - Structural Health Monitoring 2017
A2 - Chang, Fu-Kuo
A2 - Kopsaftopoulos, Fotis
PB - DEStech Publications
T2 - 11th International Workshop on Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance, IWSHM 2017
Y2 - 12 September 2017 through 14 September 2017
ER -