TY - GEN
T1 - Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package
AU - Liang, Hanshuang
AU - Houghton, Todd
AU - Song, Zeming
AU - Ma, Teng
AU - Nguyen, Hoa
AU - Chen, George
AU - Jiang, Hanqing
AU - Yu, Hongbin
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/15
Y1 - 2015/7/15
N2 - Strain distribution exists in all microelectronic devices, including emerging flexible[1] and foldable[2] electronics. When a device is subject to bending or elevated temperature, the mechanical and electrical properties change. In some cases induced or applied strain can cause the device to fail[3-5]. For this reason, accurate strain mapping techniques are of great interest[6] to the electronics industry and could provide a detailed understanding of the strain distribution across a device. This understanding will help improve the structure or layout design of mechanical and electronic devices. The laser scanning technique demonstrated in this work could potentially provide a solution to map the two dimensional (2D) strain distribution within an electronic package. We have validated the strain sensitivity and spatial resolution of features for the device in a previous report[7, 8] and are now applying the technique to a practical microelectronic package sample. Here, we demonstrate 2D strain mapping capability by preforming 2D scans across the composite solder bump region at room temperature and an elevated temperature.
AB - Strain distribution exists in all microelectronic devices, including emerging flexible[1] and foldable[2] electronics. When a device is subject to bending or elevated temperature, the mechanical and electrical properties change. In some cases induced or applied strain can cause the device to fail[3-5]. For this reason, accurate strain mapping techniques are of great interest[6] to the electronics industry and could provide a detailed understanding of the strain distribution across a device. This understanding will help improve the structure or layout design of mechanical and electronic devices. The laser scanning technique demonstrated in this work could potentially provide a solution to map the two dimensional (2D) strain distribution within an electronic package. We have validated the strain sensitivity and spatial resolution of features for the device in a previous report[7, 8] and are now applying the technique to a practical microelectronic package sample. Here, we demonstrate 2D strain mapping capability by preforming 2D scans across the composite solder bump region at room temperature and an elevated temperature.
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U2 - 10.1109/ECTC.2015.7159623
DO - 10.1109/ECTC.2015.7159623
M3 - Conference contribution
AN - SCOPUS:84942104574
T3 - Proceedings - Electronic Components and Technology Conference
SP - 396
EP - 401
BT - 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Y2 - 26 May 2015 through 29 May 2015
ER -