Abstract
Nanostructured Cu–Ta alloys show promise as high-strength materials in part due to their limited grain growth. In the present study, we elucidate the role of Ta on the transition from deformation twinning to dislocation-mediated slip mechanisms in nanocrystalline Cu through atomistic simulations and transmission electron microscopy characterization. In particular, computed generalized stacking fault energy curves show that as Ta content increases there is a shift from twinning to slip-dominated deformation mechanisms. Furthermore, heterogeneous twinnability from microstructural defects decreases with an increase in Ta. The computed effect of Ta on plasticity is consistent with the HRTEM observations.
Original language | English (US) |
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Pages (from-to) | 48-54 |
Number of pages | 7 |
Journal | Materials Research Letters |
Volume | 5 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2 2017 |
Keywords
- Nanocrystalline
- TEM
- dislocation
- twinning
ASJC Scopus subject areas
- Materials Science(all)