Temperature and moisture dependence of PCB and package traces and the impact on signal performance

Jason R. Miller, Ying Li, Kevin Hinckley, Gustavo Blando, Bruce Guenin, Istvan Novak, Aykut Dengi, Ashley Rebelo, Scott McMorrow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations


As link speeds continue to increase and operating margins are in the tens of millivolts and picoseconds, many engineers have lingering questions about the robustness of their links when one considers manufacturing, material, and temperature variation. Most hardware systems are required to reliably operate over a wide range of environmental conditions. In this paper, we examine the impact of temperature and humidity variation on the electrical properties of typical printed circuit boards traces (PCBs) and organic package traces. Test structures will be measured and the temperature-dependent, dielectric material properties, Dk(T, f) and Df(T, f), will be extracted for organic packaging materials and several PCB materials. By using two different methods, the extracted dielectric material properties can be compared and the dielectric component of loss can be isolated from the conductive loss. With the added dimension of temperature as an input parameter in our simulation environment, a temperature dependent multi-pole Debye model will be introduced to capture the dependence of the s-parameters on temperature.

Original languageEnglish (US)
Title of host publicationDesignCon 2012
Subtitle of host publicationWhere Chipheads Connect
Number of pages50
StatePublished - 2012
Externally publishedYes
EventDesignCon 2012: Where Chipheads Connect - Santa Clara, CA, United States
Duration: Jan 30 2012Feb 2 2012

Publication series

NameDesignCon 2012: Where Chipheads Connect


OtherDesignCon 2012: Where Chipheads Connect
Country/TerritoryUnited States
CitySanta Clara, CA

ASJC Scopus subject areas

  • Hardware and Architecture


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