TEM observations of Ag-Ti bilayers after thermal aging treatment in a reducing ambient

Adam I. Amali, J. W. Mayer, Yuxiao Zeng, Y. L. Zou, Terry Alford, F. Deng, S. S. Lau

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Transmission electron microscopy (TEM) in both cross sectional and plan view is used to study the effect of annealing Ag-Ti bilayers deposited on SiO 2/Si substrates in an NH 3 ambient. The resulting structure, texture and grain size are investigated. Comparisons are made between films annealed at 400, 500 and 600 °C. Silver films show increasingly strong 〈111〉 texture with annealing temperature while exhibiting a bamboo-like grain structure at 600 °C. Considerable grain growth with lateral grain sizes of up to 5 times the thickness of the Ag film is observed at 600 °C. The grains typically extend through the Ag film thickness. The Ti/SiO 2 interface uniformity and the absence of voids at the substrate surface are positive indicators of the role of titanium as a good adhesion promoter. At 600 °C, a uniform TiN encapsulation layer is observed on the Ag surface.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
Number of pages6
StatePublished - 1997
EventProceedings of the 1997 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 1 1997Apr 4 1997


OtherProceedings of the 1997 MRS Spring Symposium
CitySan Francisco, CA, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials


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