Abstract
Structural optimization techniques used in microelectronic packages and pager components are discussed. In the area of microelectronic, two problems are discussed: Plastic power package; Plastic Ball grid array package. The shape optimization of the battery contact to satisfy the design requirements of a pager is presented. Additionally, the usefulness of the optimization tool and its present limitations are discussed.
| Original language | English (US) |
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| Title of host publication | Proceedings of the Conference on Optimization in Industry |
| Editors | A.D. Belegundu, F. Mistree |
| Place of Publication | Fairfield, NJ, United States |
| Publisher | ASME |
| Pages | 159-168 |
| Number of pages | 10 |
| State | Published - 1997 |
| Event | Proceedings of the 1997 Conference on Optimization in Industry - Palm Coast, FL, USA Duration: Mar 23 1997 → Mar 27 1997 |
Other
| Other | Proceedings of the 1997 Conference on Optimization in Industry |
|---|---|
| City | Palm Coast, FL, USA |
| Period | 3/23/97 → 3/27/97 |
ASJC Scopus subject areas
- Engineering(all)