TY - GEN
T1 - Stochastic finite element modeling of fatigue damage evolution for visco-plastic materials in micro-electronics
AU - Ladani, Leila J.
AU - Razmi, Jafar
PY - 2010
Y1 - 2010
N2 - Thermo-mechanical fatigue is one of the main failure mechanisms of solder joints in electronic devices. Deterministic approaches that are typically used to predict the life of joints, may predict the life far different from the test results and field environment. This difference is caused by uncertainties introduced in finite element and damage modeling with different random variables such as material properties, geometry, damage model constants and many others. This paper presents a methodology to include these uncertainties in the life prediction approach for solder joint materials. Non-linear stochastic finite element modeling is used to evaluate the sensitivity of the life prediction results to uncertainties in elastic and inelastic material properties and damage model constants. The analyses show that from material properties, creep coefficient and activation energy are two factors that have significant effect in fluctuating the prediction results. Coefficient of Thermal Expansion was also found to have a strong effect. Analyses also show that damage model constants have more pronounced effect than material properties.
AB - Thermo-mechanical fatigue is one of the main failure mechanisms of solder joints in electronic devices. Deterministic approaches that are typically used to predict the life of joints, may predict the life far different from the test results and field environment. This difference is caused by uncertainties introduced in finite element and damage modeling with different random variables such as material properties, geometry, damage model constants and many others. This paper presents a methodology to include these uncertainties in the life prediction approach for solder joint materials. Non-linear stochastic finite element modeling is used to evaluate the sensitivity of the life prediction results to uncertainties in elastic and inelastic material properties and damage model constants. The analyses show that from material properties, creep coefficient and activation energy are two factors that have significant effect in fluctuating the prediction results. Coefficient of Thermal Expansion was also found to have a strong effect. Analyses also show that damage model constants have more pronounced effect than material properties.
KW - Pb-free solder joints
KW - Probabilistic design modeling
KW - Stochastic finite element
KW - Thermo-mechanical damage
UR - http://www.scopus.com/inward/record.url?scp=77955187528&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77955187528&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2010.5501266
DO - 10.1109/ITHERM.2010.5501266
M3 - Conference contribution
AN - SCOPUS:77955187528
SN - 9781424453429
T3 - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
BT - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
T2 - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Y2 - 2 June 2010 through 5 June 2010
ER -