Statistics of weak grain boundaries for spall damage in polycrystalline copper

L. Wayne, K. Krishnan, S. Digiacomo, N. Kovvali, Pedro Peralta, S. N. Luo, S. Greenfield, D. Byler, D. Paisley, K. J. McClellan, A. Koskelo, R. Dickerson

Research output: Contribution to journalArticlepeer-review

86 Scopus citations


Correlations between spall damage and local microstructure were investigated using polycrystalline copper samples via laser-driven plate impacts at low pressures. Electron backscattering diffraction was used to relate the presence of porosity to microstructural features such as grain boundaries and triple points. Preferred void-nucleation sites were identified in terms of their crystallography via statistical sampling in serial sectioned specimens. Results indicate that terminated twins and grain boundaries with misorientations between 25° and 50° are the preferred locations for intergranular damage localization.

Original languageEnglish (US)
Pages (from-to)1065-1068
Number of pages4
JournalScripta Materialia
Issue number11
StatePublished - Nov 2010


  • Copper
  • Electron backscattering diffraction (EBSD)
  • Grain boundaries
  • Misorientation
  • Spall

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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