TY - JOUR
T1 - Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading
AU - Chad Hornbuckle, B.
AU - Williams, Cyril L.
AU - Dean, Steven W.
AU - Zhou, Xuyang
AU - Kale, Chaitanya
AU - Turnage, Scott A.
AU - Clayton, John D.
AU - Thompson, Gregory B.
AU - Giri, Anit K.
AU - Solanki, Kiran N.
AU - Darling, Kristopher A.
N1 - Publisher Copyright:
© 2020, This is a U.S. government work and not under copyright protection in the U.S.; foreign copyright protection may apply.
PY - 2020/12
Y1 - 2020/12
N2 - The microstructures of materials typically undergo significant changes during shock loading, causing failure when higher shock pressures are reached. However, preservation of microstructural and mechanical integrity during shock loading are essential in situations such as space travel, nuclear energy, protection systems, extreme geological events, and transportation. Here, we report ex situ shock behavior of a chemically optimized and microstructurally stable, bulk nanocrystalline copper–tantalum alloy that shows a relatively unchanged microstructure or properties when shock compressed up to 15 GPa. The absence of shock-hardening indicates that the grains and grain boundaries that make up the stabilized nanocrystalline microstructure act as stable sinks, thereby annihilating deformation-induced defects during shock loading. This study helps to advance the possibility of developing advanced structural materials for extreme applications where shock loading occurs.
AB - The microstructures of materials typically undergo significant changes during shock loading, causing failure when higher shock pressures are reached. However, preservation of microstructural and mechanical integrity during shock loading are essential in situations such as space travel, nuclear energy, protection systems, extreme geological events, and transportation. Here, we report ex situ shock behavior of a chemically optimized and microstructurally stable, bulk nanocrystalline copper–tantalum alloy that shows a relatively unchanged microstructure or properties when shock compressed up to 15 GPa. The absence of shock-hardening indicates that the grains and grain boundaries that make up the stabilized nanocrystalline microstructure act as stable sinks, thereby annihilating deformation-induced defects during shock loading. This study helps to advance the possibility of developing advanced structural materials for extreme applications where shock loading occurs.
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U2 - 10.1038/s43246-020-0024-3
DO - 10.1038/s43246-020-0024-3
M3 - Article
AN - SCOPUS:85126163297
SN - 2662-4443
VL - 1
JO - Communications Materials
JF - Communications Materials
IS - 1
M1 - 22
ER -