SOC vs. SIP; Are we putting too much on one chip?

Robert Aitken, Lawrence Clark, Pieter Hooijmans, Anthony Gadlent, David Allstot, Kenneth Brown, Peter Rickert

Research output: Chapter in Book/Report/Conference proceedingConference contribution


With every generation, CMOS scaling makes additional chip area available to designers. For several generations now, designers have taken advantage of this extra area by integrating functions that were previously on multiple chips into a single die, a so-called System-on-Chip (SoC). Initially, SoC integration was primarily limited to digital circuitry, embedded SRAM, and processor cores. Recently, advances in technology have made possible the integration of other circuitry, including analog and mixed signal, DRAM, flash and even RF. However, just because something is feasible does not necessarily make it desirable. The panel addresses the question of whether we have pushed the bounds of integration too far - should we build a single chip radio or embedded flash, or are other approaches, such as System-In-Package, better? The panelists have broad experience in the field and will address the question from both technological and business standpoints.

Original languageEnglish (US)
Title of host publicationProceedings of the Custom Integrated Circuits Conference
Number of pages1
StatePublished - 2004
Externally publishedYes
EventProceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC - Orlando, FL, United States
Duration: Oct 3 2004Oct 6 2004


OtherProceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC
Country/TerritoryUnited States
CityOrlando, FL

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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