Separable beamforming for 3-D synthetic aperture ultrasound imaging

Ming Yang, Richard Sampson, Thomas F. Wenisch, Chaitali Chakrabarti

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations


Recently, there has been great interest in 3-D ultrasound imaging, but power constraints have precluded practical implementation of highresolution 3-D ultrasound in handheld imaging platforms. In this paper, we propose a separable beamforming procedure for subaperturebased 3-D synthetic aperture ultrasound systems that drastically reduces computational (and hence power) requirements. Separable beamforming approximates 2-D array beamforming through a series of 1-D beamforming operations. Our proposed method is based on a separable delay decomposition method that minimizes phase error. We show that the proposed separable system achieves 19- fold complexity reduction while producing images with contrastto- noise ratio comparable to that of non-separable systems. Furthermore, we propose an online iterative delay calculation method that substantially reduces storage requirements. We briefly describe how the separable beamformer can be implemented in the context of Sonic Millip3De, our recently proposed hardware accelerator for the digital front-end of a 3-D ultrasound system.

Original languageEnglish (US)
Title of host publication2013 IEEE Workshop on Signal Processing Systems, SiPS 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Print)9781467362382
StatePublished - 2013
Event2013 IEEE Workshop on Signal Processing Systems, SiPS 2013 - Taipei, Taiwan, Province of China
Duration: Oct 16 2013Oct 18 2013

Publication series

NameIEEE Workshop on Signal Processing Systems, SiPS: Design and Implementation
ISSN (Print)1520-6130


Other2013 IEEE Workshop on Signal Processing Systems, SiPS 2013
Country/TerritoryTaiwan, Province of China


  • 2-D array
  • Hardware implementation
  • Separable beamforming
  • Separable delay

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Signal Processing
  • Applied Mathematics
  • Hardware and Architecture


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