Abstract
A novel process to achieve selective deposition of ruthenium (Ru) films was carried out by using liquid-source digital-chemical vapor deposition and by alternate exposures of Ru(thd)2cod and oxygen. The selective deposition of Ru films were performed at 280-320°C on the exposed area of hydroxyl-terminated atomic layer deposition produced HfO2 surfaces patterned with photoresist. Ru films showed 100% step coverage on deposition at 290°C on patterned SiO2/Si substrates. The results show that the Ru films were dense and polycrystalline and also showed an electrical resistivity of 20.6 μωcm at 272 K.
Original language | English (US) |
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Pages (from-to) | 94-98 |
Number of pages | 5 |
Journal | Chemical Vapor Deposition |
Volume | 11 |
Issue number | 2 |
DOIs | |
State | Published - Feb 2005 |
ASJC Scopus subject areas
- Chemistry(all)
- Surfaces and Interfaces
- Process Chemistry and Technology