TY - GEN
T1 - RAPID 3D PRINTING OF NANOPOROUS COPPER POWDERS VIA MICRO-CLIP
AU - Liu, Luyang
AU - Kublic, Natalya
AU - Azeredo, Bruno
AU - Chen, Xiangfan
N1 - Publisher Copyright:
Copyright © 2023 by ASME.
PY - 2023
Y1 - 2023
N2 - Three-dimensional (3D) printing of metal components through powder bed fusion, material extrusion, and vat photopolymerization, has attracted interest continuously. Particularly, extrusion-based and photopolymerization-based processes employ metal particle-reinforced polymer matrix composites (PMCs) as raw materials. However, the resolution for extrusion-based printing is limited by the speed-accuracy tradeoff. In contrast, photopolymerization-based processes can significantly improve the printing resolution, but the filler loading of the PMC is typically low due to the critical requirement on raw materials’ rheological properties. Herein, we develop a new metal 3D printing strategy by utilizing micro-continuous liquid interface printing (μCLIP) to print PMC resins comprising nanoporous copper (NP-Cu) powders. By balancing the need for higher filler loading and the requirements on rheological properties to enable printability for the μCLIP, the compositions of PMC resin were optimized. In detail, the concentration of the NP-Cu powders in the resins can reach up to 40 wt% without sacrificing the printability and printing speed (10 μm·s–1). After sintering, 3D copper structures with microscale features (470 ± 140 μm in diameter) manifesting an average resistivity of 150 kΩ·mm can be realized. In summary, this new strategy potentially benefits the rapid prototyping of metal components with higher resolution at faster speeds.
AB - Three-dimensional (3D) printing of metal components through powder bed fusion, material extrusion, and vat photopolymerization, has attracted interest continuously. Particularly, extrusion-based and photopolymerization-based processes employ metal particle-reinforced polymer matrix composites (PMCs) as raw materials. However, the resolution for extrusion-based printing is limited by the speed-accuracy tradeoff. In contrast, photopolymerization-based processes can significantly improve the printing resolution, but the filler loading of the PMC is typically low due to the critical requirement on raw materials’ rheological properties. Herein, we develop a new metal 3D printing strategy by utilizing micro-continuous liquid interface printing (μCLIP) to print PMC resins comprising nanoporous copper (NP-Cu) powders. By balancing the need for higher filler loading and the requirements on rheological properties to enable printability for the μCLIP, the compositions of PMC resin were optimized. In detail, the concentration of the NP-Cu powders in the resins can reach up to 40 wt% without sacrificing the printability and printing speed (10 μm·s–1). After sintering, 3D copper structures with microscale features (470 ± 140 μm in diameter) manifesting an average resistivity of 150 kΩ·mm can be realized. In summary, this new strategy potentially benefits the rapid prototyping of metal components with higher resolution at faster speeds.
KW - high resolution
KW - micro-continuous liquid interface printing
KW - nanoporous copper powders
UR - http://www.scopus.com/inward/record.url?scp=85176792263&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85176792263&partnerID=8YFLogxK
U2 - 10.1115/msec2023-104610
DO - 10.1115/msec2023-104610
M3 - Conference contribution
AN - SCOPUS:85176792263
T3 - Proceedings of ASME 2023 18th International Manufacturing Science and Engineering Conference, MSEC 2023
BT - Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering
PB - American Society of Mechanical Engineers
T2 - ASME 2023 18th International Manufacturing Science and Engineering Conference, MSEC 2023
Y2 - 12 June 2023 through 16 June 2023
ER -