Principal pilot line manufacturing challenges and solutions in direct fabrication of a-Si:H TFT arrays on flexible substrates

Shawn M. O'Rourke, Douglas E. Loy, Curt Moyer, Scott K. Ageno, Barry P. O'Brien, Dirk Bottesch, Michael Marrs, Jeff Dailey, Edward J. Bawolek, Jovan Trujillo, Jann Kaminski, David Allee, Sameer M. Venugopal, Rita Cordova, Nicholas Colaneri, Gregory Raupp

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Principal challenges to direct fabrication of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. Viable solutions to address these challenges are described.

Original languageEnglish (US)
Title of host publicationSociety for Information Display - 10th Asian Symposium on Information Display 2007, ASID'07
Pages424-428
Number of pages5
StatePublished - 2007
Event10th Asian Symposium on Information Display, ASID'07 - Singapore, Singapore
Duration: Aug 2 2007Aug 3 2007

Publication series

NameSociety for Information Display - 10th Asian Symposium on Information Display 2007, ASID'07

Other

Other10th Asian Symposium on Information Display, ASID'07
Country/TerritorySingapore
CitySingapore
Period8/2/078/3/07

ASJC Scopus subject areas

  • Hardware and Architecture
  • Information Systems
  • Electrical and Electronic Engineering

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