TY - GEN
T1 - Predicting Cycle Time Distributions with Aggregate Modelling of Work Areas in a Real-World Wafer Fab
AU - Deenen, Patrick C.
AU - Adan, Jelle
AU - Fowler, John W.
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - In a semiconductor wafer fabrication facility (wafer fab) it is important to accurately predict wafer outs, i.e. the remaining cycle time of the wafers in process. A wafer fab consists of multiple work areas, each containing a specific process technology, for example, photolithography, metal deposition or etching. Therefore, to accurately predict the wafer outs, an accurate prediction of the cycle time distribution at each work area is essential. This paper proposes an aggregate model to simulate each of these work areas. The aggregate model is a single server with an aggregate process time distribution and an overtaking distribution. Both distributions are WIP-dependent, but an additional layer-type dependency is introduced for the overtaking distribution. Application on a real-world wafer fabrication facility of a semiconductor manufacturer is presented for the work areas of photolithography, oxidation and dry etch. These experiments show that the aggregate model can, under certain circumstances, accurately predict the cycle time distributions in work areas by layer-type.
AB - In a semiconductor wafer fabrication facility (wafer fab) it is important to accurately predict wafer outs, i.e. the remaining cycle time of the wafers in process. A wafer fab consists of multiple work areas, each containing a specific process technology, for example, photolithography, metal deposition or etching. Therefore, to accurately predict the wafer outs, an accurate prediction of the cycle time distribution at each work area is essential. This paper proposes an aggregate model to simulate each of these work areas. The aggregate model is a single server with an aggregate process time distribution and an overtaking distribution. Both distributions are WIP-dependent, but an additional layer-type dependency is introduced for the overtaking distribution. Application on a real-world wafer fabrication facility of a semiconductor manufacturer is presented for the work areas of photolithography, oxidation and dry etch. These experiments show that the aggregate model can, under certain circumstances, accurately predict the cycle time distributions in work areas by layer-type.
UR - http://www.scopus.com/inward/record.url?scp=85126127363&partnerID=8YFLogxK
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U2 - 10.1109/WSC52266.2021.9715528
DO - 10.1109/WSC52266.2021.9715528
M3 - Conference contribution
AN - SCOPUS:85126127363
T3 - Proceedings - Winter Simulation Conference
BT - 2021 Winter Simulation Conference, WSC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 Winter Simulation Conference, WSC 2021
Y2 - 12 December 2021 through 15 December 2021
ER -