TY - GEN
T1 - Power reduction of functional units considering temperature and process variations
AU - Kannan, Deepa
AU - Shrivastava, Aviral
AU - Bhardwaj, Sarvesh
AU - Vrudhula, Sarma
PY - 2008
Y1 - 2008
N2 - Continuous technology scaling has resulted in an increase in both, the power density as well as the variation in device dimensions (process variations) of the manufactured processors. Both power density and process variations have a significant impact on the leakage power. Therefore, power optimization techniques should be sensitive to the variation in leakage power due to both temperature as well as process variations. Operation to Functional Units Binding Mechanism (OFBM) is the mechanism to dynamically issue operations to Functional Units (FUs) in superscalar processors. We propose a Leakage-Aware OFBM (LA-OFBM), which is both temperature and process variation aware. Our experimental results demostrate that LA-OFBM reduces the mean and standard deviation of the total energy consumption of ALUs by 18%, and 46% respectively, as compared to the traditional OFBM, without any performance penalty.
AB - Continuous technology scaling has resulted in an increase in both, the power density as well as the variation in device dimensions (process variations) of the manufactured processors. Both power density and process variations have a significant impact on the leakage power. Therefore, power optimization techniques should be sensitive to the variation in leakage power due to both temperature as well as process variations. Operation to Functional Units Binding Mechanism (OFBM) is the mechanism to dynamically issue operations to Functional Units (FUs) in superscalar processors. We propose a Leakage-Aware OFBM (LA-OFBM), which is both temperature and process variation aware. Our experimental results demostrate that LA-OFBM reduces the mean and standard deviation of the total energy consumption of ALUs by 18%, and 46% respectively, as compared to the traditional OFBM, without any performance penalty.
UR - http://www.scopus.com/inward/record.url?scp=47649085412&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=47649085412&partnerID=8YFLogxK
U2 - 10.1109/VLSI.2008.81
DO - 10.1109/VLSI.2008.81
M3 - Conference contribution
AN - SCOPUS:47649085412
SN - 0769530834
SN - 9780769530833
T3 - Proceedings of the IEEE International Frequency Control Symposium and Exposition
SP - 533
EP - 538
BT - Proceedings - 21st International Conference on VLSI Design, VLSI DESIGN 2008
T2 - 21st International Conference on VLSI Design, VLSI DESIGN 2008
Y2 - 4 January 2008 through 8 January 2008
ER -