Optimization of electrothermal material parameters using inverse modeling

Rainer Minixhofer, Stefan Holzer, Clemens Heitzinger, Johannes Fellner, Tibor Grasser, Siegfried Selberherr

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations


A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.

Original languageEnglish (US)
Title of host publicationESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference
EditorsJose Franca, Paulo Freitas
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)0780379993
ISBN (Print)9780780379992
StatePublished - 2003
Externally publishedYes
Event33rd European Solid-State Device Research Conference, ESSDERC 2003 - Estoril, Portugal
Duration: Sep 16 2003Sep 18 2003

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876


Other33rd European Solid-State Device Research Conference, ESSDERC 2003

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality


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