On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

K. E. Yazzie; H. X. Xie; J. J. Williams; Nikhilesh Chawla

doi:10.1016/j.scriptamat.2012.01.009

On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

K. E. Yazzie, H. X. Xie, J. J. Williams, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

58 Scopus citations

Abstract

The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.

Original language	English (US)
Pages (from-to)	586-589
Number of pages	4
Journal	Scripta Materialia
Volume	66
Issue number	8
DOIs	https://doi.org/10.1016/j.scriptamat.2012.01.009
State	Published - Apr 2012

Keywords

Cu Sn
Ductile fracture
Intermetallic compound
Mechanical shock
Pb-free solder

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

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10.1016/j.scriptamat.2012.01.009

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@article{e4aa22a417544c7eb80999f4680b4b3e,

title = "On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints",

abstract = "The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.",

keywords = "Cu Sn, Ductile fracture, Intermetallic compound, Mechanical shock, Pb-free solder",

author = "Yazzie, {K. E.} and Xie, {H. X.} and Williams, {J. J.} and Nikhilesh Chawla",

note = "Funding Information: The authors are grateful for the financial support for this work from the National Science Foundation Division of Materials Research—Metals Division (Drs. Alan Ardell, Bruce MacDonald, and Harsh Chopra, Program Directors).The authors gratefully acknowledge the use of facilities within the Center for Solid State Science at Arizona State University. ",

year = "2012",

month = apr,

doi = "10.1016/j.scriptamat.2012.01.009",

language = "English (US)",

volume = "66",

pages = "586--589",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "8",

}

TY - JOUR

T1 - On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

AU - Yazzie, K. E.

AU - Xie, H. X.

AU - Williams, J. J.

AU - Chawla, Nikhilesh

N1 - Funding Information: The authors are grateful for the financial support for this work from the National Science Foundation Division of Materials Research—Metals Division (Drs. Alan Ardell, Bruce MacDonald, and Harsh Chopra, Program Directors).The authors gratefully acknowledge the use of facilities within the Center for Solid State Science at Arizona State University.

PY - 2012/4

Y1 - 2012/4

N2 - The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.

AB - The strain-rate-dependent mechanical behavior of Sn-rich solder is of fundamental importance. Dynamic solder joint strength is hypothesized to be controlled by two factors. At low strain rates it is believed to be controlled by the bulk solder and at high strain rates by the brittle intermetallic layer. In this paper, the dynamic solder joint strength of Sn-3.9Ag-0.7Cu solder joints was experimentally quantified to verify the solder and intermetallic compound-controlled behavior hypothesis.

KW - Cu Sn

KW - Ductile fracture

KW - Intermetallic compound

KW - Mechanical shock

KW - Pb-free solder

UR - http://www.scopus.com/inward/record.url?scp=84862777806&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84862777806&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2012.01.009

DO - 10.1016/j.scriptamat.2012.01.009

M3 - Article

AN - SCOPUS:84862777806

SN - 1359-6462

VL - 66

SP - 586

EP - 589

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

Abstract

Keywords

ASJC Scopus subject areas

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