Abstract
In a recent article [J. Rajagopalan, J.H. Han, M.T.A. Saif, Science 315 (2007) 1831-1834], we have reported substantial (50-100%) plastic strain recovery in freestanding nanocrystalline metal films (grain size 50-65 nm) after unloading. The strain recovery was time dependent and thermally activated. Here we model the time evolution of this strain recovery in terms of a thermally activated dislocation propagation mechanism. The model predicts an activation volume of ≈42b3 for the strain recovery process in aluminum.
Original language | English (US) |
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Pages (from-to) | 921-926 |
Number of pages | 6 |
Journal | Scripta Materialia |
Volume | 59 |
Issue number | 9 |
DOIs | |
State | Published - Nov 2008 |
Externally published | Yes |
Keywords
- Nanocrystalline microstructure
- Plastic deformation
- Strain recovery
- Thermally activated processes
- Thin films
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys