TY - GEN
T1 - On-Demand SIMO Channel Impulse Response Shaping in Smart On-Chip Electromagnetic Environments
AU - Imani, Mohammadreza F.
AU - Abadal, Sergi
AU - Hougne, Philipp Del
N1 - Publisher Copyright:
© 2021 Owner/Author.
PY - 2021/11/15
Y1 - 2021/11/15
N2 - We recently introduced the concept of reconfigurable Wireless Networks on Chips (r-WNoCs) for which an on-chip reconfigurable intelligent surface (RIS) endows the wireless on-chip propagation environment with programmability. In this work-in-progress report, we apply this idea to a single-input multiple-output (SIMO) context. Specifically, we demonstrate that using an on-chip RIS we can simultaneously shape multiple channel impulse responses (CIRs) such that they become essentially pulse-like despite rich scattering inside the chip enclosure. Pulse-like CIRs are essential to enable high-speed information exchange between different processors on the same chip with the simple on-off-keying modulation schemes envisaged for WNoCs.
AB - We recently introduced the concept of reconfigurable Wireless Networks on Chips (r-WNoCs) for which an on-chip reconfigurable intelligent surface (RIS) endows the wireless on-chip propagation environment with programmability. In this work-in-progress report, we apply this idea to a single-input multiple-output (SIMO) context. Specifically, we demonstrate that using an on-chip RIS we can simultaneously shape multiple channel impulse responses (CIRs) such that they become essentially pulse-like despite rich scattering inside the chip enclosure. Pulse-like CIRs are essential to enable high-speed information exchange between different processors on the same chip with the simple on-off-keying modulation schemes envisaged for WNoCs.
KW - ISI Mitigation
KW - Over-the-Air Equalization
KW - Reconfigurable Intelligent Surface
KW - SIMO
KW - Software-Defined Metamaterial
KW - Wireless Network-on-Chip
UR - http://www.scopus.com/inward/record.url?scp=85120908093&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85120908093&partnerID=8YFLogxK
U2 - 10.1145/3485730.3494043
DO - 10.1145/3485730.3494043
M3 - Conference contribution
AN - SCOPUS:85120908093
T3 - SenSys 2021 - Proceedings of the 2021 19th ACM Conference on Embedded Networked Sensor Systems
SP - 642
EP - 644
BT - SenSys 2021 - Proceedings of the 2021 19th ACM Conference on Embedded Networked Sensor Systems
PB - Association for Computing Machinery, Inc
T2 - 19th ACM Conference on Embedded Networked Sensor Systems, SenSys 2021
Y2 - 15 November 2021 through 17 November 2021
ER -