TY - GEN
T1 - On analytic model of multiple vias for high-speed printed circuit board and electric band-gap structures
AU - Zhang, Lisha
AU - Pan, George
AU - Guo, Zhonghai
PY - 2012/12/1
Y1 - 2012/12/1
N2 - We developed a full-wave formulation to model massive number of vias in high-speed printed circuit board (PCB), through silicon via (TSV) and electric band-gap (EBG) structures. This analytic method employs the equivalent magnetic frill array, Galerkin's procedure, image theory and Fourier transform to simplify the problem from a 3D configuration into a 2D frame. Based on Bessel's functions and addition theorem, the final matrix equation is formulated analytically without using any numerical techniques. The new method is purely from the boundary conditions. Consequently, it is simple, versatile, efficient and accurate. Numerical examples demonstrate good agreement between our analytical solution and commercial software (HFSS) for through silicon and PCB vias. The model is also used to study the EBG wall and cavity, for leakage fields.
AB - We developed a full-wave formulation to model massive number of vias in high-speed printed circuit board (PCB), through silicon via (TSV) and electric band-gap (EBG) structures. This analytic method employs the equivalent magnetic frill array, Galerkin's procedure, image theory and Fourier transform to simplify the problem from a 3D configuration into a 2D frame. Based on Bessel's functions and addition theorem, the final matrix equation is formulated analytically without using any numerical techniques. The new method is purely from the boundary conditions. Consequently, it is simple, versatile, efficient and accurate. Numerical examples demonstrate good agreement between our analytical solution and commercial software (HFSS) for through silicon and PCB vias. The model is also used to study the EBG wall and cavity, for leakage fields.
UR - http://www.scopus.com/inward/record.url?scp=84874459695&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84874459695&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2012.6457904
DO - 10.1109/EPEPS.2012.6457904
M3 - Conference contribution
AN - SCOPUS:84874459695
SN - 9781467325394
T3 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
SP - 311
EP - 314
BT - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
T2 - 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Y2 - 21 October 2012 through 24 October 2012
ER -