Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits

Physics & Astronomy

• solders 90%
• integrated circuits 76%
• numerical analysis 74%
• silicon 43%
• durability 20%
• chips 9%
• analysis of variance 8%
• copper 8%
• fatigue life 8%
• cycles 8%
• packaging 6%
• hardening 5%
• interlayers 5%
• industries 5%
• plastics 4%
• computer programs 4%
• continuums 4%
• damage 4%
• estimates 3%
• energy 1%

Engineering & Materials Science

• Soldering alloys 79%
• Integrated circuits 74%
• Numerical analysis 70%
• Silicon 63%
• Durability 15%
• Copper 10%
• Three dimensional integrated circuits 8%
• Analysis of variance (ANOVA) 6%
• Hardening 5%
• Packaging 5%
• Plastics 4%
• Experiments 4%
• Fatigue of materials 4%
• Hot Temperature 2%
• Industry 2%

Chemical Compounds

• Solder 100%
• Industry 11%