Novel rare-earth-containing lead-free solders with enhanced ductility

M. A. Dudek, R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

54 Scopus citations


Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations oftin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements have been shown to refine the microstructure of several lead-free solder systems, thus improving their mechanical properties. This study investigated the effect of the addition of lanthanum on the melting behavior, microstructure, and shear strength of an Sn-3.9Ag-0.7Cu alloy. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed.

Original languageEnglish (US)
Pages (from-to)57-62
Number of pages6
Issue number6
StatePublished - Jun 2006

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering


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