TY - JOUR
T1 - Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition
T2 - Effect of environmental humidity
AU - Morsali, Seyedreza
AU - Daryadel, Soheil
AU - Zhou, Zhong
AU - Behroozfar, Ali
AU - Qian, Dong
AU - Minary-Jolandan, Majid
N1 - Publisher Copyright:
© 2017 Author(s).
PY - 2017/1/14
Y1 - 2017/1/14
N2 - Capability to print metals at micro/nanoscale in arbitrary 3D patterns at local points of interest will have applications in nano-electronics and sensors. Meniscus-confined electrodeposition (MCED) is a manufacturing process that enables depositing metals from an electrolyte containing nozzle (pipette) in arbitrary 3D patterns. In this process, a meniscus (liquid bridge or capillary) between the pipette tip and the substrate governs the localized electrodeposition process. Fabrication of metallic microstructures using this process is a multi-physics process in which electrodeposition, fluid dynamics, and mass and heat transfer physics are simultaneously involved. We utilized multi-physics finite element simulation, guided by experimental data, to understand the effect of water evaporation from the liquid meniscus at the tip of the nozzle for deposition of free-standing copper microwires in MCED process.
AB - Capability to print metals at micro/nanoscale in arbitrary 3D patterns at local points of interest will have applications in nano-electronics and sensors. Meniscus-confined electrodeposition (MCED) is a manufacturing process that enables depositing metals from an electrolyte containing nozzle (pipette) in arbitrary 3D patterns. In this process, a meniscus (liquid bridge or capillary) between the pipette tip and the substrate governs the localized electrodeposition process. Fabrication of metallic microstructures using this process is a multi-physics process in which electrodeposition, fluid dynamics, and mass and heat transfer physics are simultaneously involved. We utilized multi-physics finite element simulation, guided by experimental data, to understand the effect of water evaporation from the liquid meniscus at the tip of the nozzle for deposition of free-standing copper microwires in MCED process.
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U2 - 10.1063/1.4973622
DO - 10.1063/1.4973622
M3 - Article
AN - SCOPUS:85009469945
SN - 0021-8979
VL - 121
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 2
M1 - 024903
ER -