TY - GEN
T1 - Modeling thermal effects in fully-depleted SOI devices with arbitrary crystallographic orientation
AU - Raleva, K.
AU - Vasileska, Dragica
AU - Goodnick, Stephen
PY - 2011/3/1
Y1 - 2011/3/1
N2 - In this work we continue our investigation on the heating effects in nano-scale FD-SOI devices using an in-house thermal particle-based device simulator. We focus on the current variations for FD-SOI devices with arbitrary crystallographic orientation and examine which crystallographic orientation gives better results from electrical and thermal point of view. Our simulation results demonstrate that one can obtain the lowest current degradation with (110) wafer orientation. The temperature of the hot-spot is the smallest for (110)-orientation as well.
AB - In this work we continue our investigation on the heating effects in nano-scale FD-SOI devices using an in-house thermal particle-based device simulator. We focus on the current variations for FD-SOI devices with arbitrary crystallographic orientation and examine which crystallographic orientation gives better results from electrical and thermal point of view. Our simulation results demonstrate that one can obtain the lowest current degradation with (110) wafer orientation. The temperature of the hot-spot is the smallest for (110)-orientation as well.
KW - crystallographic orientation
KW - nano-scale FD-SOI devices
KW - particle-based device simulations
KW - self-heating effects
UR - http://www.scopus.com/inward/record.url?scp=79951987500&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79951987500&partnerID=8YFLogxK
U2 - 10.1007/978-3-642-18466-6_11
DO - 10.1007/978-3-642-18466-6_11
M3 - Conference contribution
AN - SCOPUS:79951987500
SN - 9783642184659
T3 - Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)
SP - 103
EP - 109
BT - Numerical Methods and Applications - 7th International Conference, NMA 2010, Revised Papers
T2 - 7th International Conference on Numerical Methods and Applications, NMA 2010
Y2 - 20 August 2010 through 24 August 2010
ER -