Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing

L. Jiang, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

103 Scopus citations


The micromechanical behavior of single-crystal Cu6Sn5 was studied by microcompression testing of pillars. The pillars were fabricated by focused ion beam milling and tested using a nanoindenter with a flat tip. The stress-strain behavior and fractographic analysis show that Cu6Sn5 deforms elastically and undergoes cleavage, resulting in fracture. The strain bursts on stress-strain curves correspond to cleavage on various planes. The fracture stress calculated using the area at the top of pillars was independent of taper angle.

Original languageEnglish (US)
Pages (from-to)480-483
Number of pages4
JournalScripta Materialia
Issue number5
StatePublished - Sep 1 2010


  • CuSn
  • Focused ion beam
  • Lead-free solder
  • Micropillar compression

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys


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