Interaction of water with silicon dioxide at low temperature relevant to CMP

Scott A. Gold, Veronica Burrows

Research output: Contribution to journalArticlepeer-review

6 Scopus citations


The reaction of water with silicon dioxide to form silanol species has been proposed to be a major component of the silicon dioxide chemical mechanical penalization (CMP) mechanism. Internal-reflection infrared spectroscopy was used to examine this reaction at low temperatures relevant to CMP of silicon dioxide thin films during integrated circuit manufacture (20-80°C). No significant reaction was observed at 20°C; some silanol formation was observed at 80°C with long exposure times. Molecular water was the predominant hydrous species observed at 80°C indicating that silanol formation does not contribute as significantly to the CMP removal process as previously thought.

Original languageEnglish (US)
Article number4
Pages (from-to)G295-G298
JournalElectrochemical and Solid-State Letters
Issue number12
StatePublished - 2004

ASJC Scopus subject areas

  • General Chemical Engineering
  • General Materials Science
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering


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