Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

Hao Wu; Donald S. Gardner; Cheng Lv; Zhihua Zou; Hongbin Yu

doi:10.1109/ECTC.2014.6897458

Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

Hao Wu, Donald S. Gardner, Cheng Lv, Zhihua Zou, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Scopus citations

Abstract

In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.

Original language	English (US)
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1290-1295
Number of pages	6
ISBN (Electronic)	9781479924073
DOIs	https://doi.org/10.1109/ECTC.2014.6897458
State	Published - Sep 11 2014
Event	64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States Duration: May 27 2014 → May 30 2014

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	64th Electronic Components and Technology Conference, ECTC 2014
Country/Territory	United States
City	Orlando
Period	5/27/14 → 5/30/14

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2014.6897458

Cite this

Wu, H., Gardner, D. S., Lv, C., Zou, Z., & Yu, H. (2014). Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. In Proceedings - Electronic Components and Technology Conference (pp. 1290-1295). Article 6897458 (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897458

Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. / Wu, Hao; Gardner, Donald S.; Lv, Cheng et al.
Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1290-1295 6897458 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wu, H, Gardner, DS, Lv, C, Zou, Z & Yu, H 2014, Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. in Proceedings - Electronic Components and Technology Conference., 6897458, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 1290-1295, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 5/27/14. https://doi.org/10.1109/ECTC.2014.6897458

Wu H, Gardner DS, Lv C, Zou Z, Yu H. Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. In Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1290-1295. 6897458. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2014.6897458

Wu, Hao ; Gardner, Donald S. ; Lv, Cheng et al. / Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications. Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 1290-1295 (Proceedings - Electronic Components and Technology Conference).

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abstract = "In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.",

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AB - In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.

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Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

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