Influence of underlayer and encapsulation process on texture in polycrystalline silver thin films

Yuxiao Zeng, Y. L. Zou, Terry Alford, F. Deng, S. S. Lau, T. Laursen, B. Manfred Ullrich

Research output: Chapter in Book/Report/Conference proceedingConference contribution


The texture in polycrystalline Ag thin films prepared by e-beam evaporation has been characterized by an x-ray diffraction technique as a function of underlayers and encapsulation temperatures. The Ag films deposited on Ti layers showed a strong 〈111〉 fiber texture with a fiber axis parallel to the film normal, whereas an almost random orientation was observed in the Ag films on Cr layers. This underlayer dependence of texture is associated with the lattice match between Ag and underlayer metal. In addition to 〈111〉 texture, the Ag films on Ti also exhibited a 〈511〉 texture component, which is the result of twinning of 〈111〉-oriented grains. After the encapsulation process, the 〈111〉 texture in the Ag films on Ti was significantly improved, as evidenced by an increased (111) diffraction intensity and a slightly narrower space distribution of the texture along the fiber axis. The highly textured Ag films are expected to exhibit an improved electromigration resistance.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
Number of pages6
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 MRS Spring Symposium - San Francisco, CA, USA
Duration: Apr 1 1997Apr 4 1997


OtherProceedings of the 1997 MRS Spring Symposium
CitySan Francisco, CA, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials


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