TY - JOUR
T1 - High-Throughput In-Memory Computing for Binary Deep Neural Networks with Monolithically Integrated RRAM and 90-nm CMOS
AU - Yin, Shihui
AU - Sun, Xiaoyu
AU - Yu, Shimeng
AU - Seo, Jae Sun
N1 - Funding Information:
Manuscript received March 28, 2020; revised June 18, 2020 and July 23, 2020; accepted August 3, 2020. Date of publication August 19, 2020; date of current version September 22, 2020. This work was supported in part by NSF-SRC-E2CDA under Contract 2018-NC-2762B; in part by NSF under Grant 1652866, Grant 1715443, and Grant 1740225; in part by JUMP C-BRIC; and in part by JUMP ASCENT (SRC Program sponsored by the Defense Advanced Research Projects Agency (DARPA)). The review of this article was arranged by Editor T.-H. Kim. (Corresponding author: Jae-sun Seo.) Shihui Yin and Jae-sun Seo are with the School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ 85287 USA (e-mail: shimeng.yu@ece.gatech.edu; jaesun.seo@asu.edu).
Publisher Copyright:
© 2020 IEEE Computer Society. All rights reserved.
PY - 2020/10
Y1 - 2020/10
N2 - Deep neural network (DNN) hardware designs have been bottlenecked by conventional memories, such as SRAM due to density, leakage, and parallel computing challenges. Resistive devices can address the density and volatility issues but have been limited by peripheral circuit integration. In this work, we present a resistive RAM (RRAM)-based in-memory computing (IMC) design, which is fabricated in 90-nm CMOS with monolithic integration of RRAM devices. We integrated a 128 × 64 RRAM array with CMOS peripheral circuits, including row/column decoders and flash analog-To-digital converters (ADCs), which collectively become a core component for scalable RRAM-based IMC for large DNNs. To maximize IMC parallelism, we assert all 128 wordlines of the RRAM array simultaneously, perform analog computing along the bitlines, and digitize the bitline voltages using ADCs. The resistance distribution of low-resistance states is tightened by an iterativewrite-verify scheme. Prototype chip measurements demonstrate high binary DNN accuracy of 98.5% for MNIST and 83.5% for CIFAR-10 data sets, with 24 TOPS/W and 158 GOPS. This represents 22.3× and 10.1× improvements in throughput and energy-delay product (EDP), respectively, compared with the state-of-The-Art literature, which can enable intelligent functionalities for area-/energy-constrainededge computing devices.
AB - Deep neural network (DNN) hardware designs have been bottlenecked by conventional memories, such as SRAM due to density, leakage, and parallel computing challenges. Resistive devices can address the density and volatility issues but have been limited by peripheral circuit integration. In this work, we present a resistive RAM (RRAM)-based in-memory computing (IMC) design, which is fabricated in 90-nm CMOS with monolithic integration of RRAM devices. We integrated a 128 × 64 RRAM array with CMOS peripheral circuits, including row/column decoders and flash analog-To-digital converters (ADCs), which collectively become a core component for scalable RRAM-based IMC for large DNNs. To maximize IMC parallelism, we assert all 128 wordlines of the RRAM array simultaneously, perform analog computing along the bitlines, and digitize the bitline voltages using ADCs. The resistance distribution of low-resistance states is tightened by an iterativewrite-verify scheme. Prototype chip measurements demonstrate high binary DNN accuracy of 98.5% for MNIST and 83.5% for CIFAR-10 data sets, with 24 TOPS/W and 158 GOPS. This represents 22.3× and 10.1× improvements in throughput and energy-delay product (EDP), respectively, compared with the state-of-The-Art literature, which can enable intelligent functionalities for area-/energy-constrainededge computing devices.
KW - Deep neural networks (DNNs)
KW - in-memory computing (IMC)
KW - monolithic integration
KW - nonvolatile memory (NVM)
KW - resistive RAM (RRAM)
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U2 - 10.1109/TED.2020.3015178
DO - 10.1109/TED.2020.3015178
M3 - Article
AN - SCOPUS:85092194539
SN - 0018-9383
VL - 67
SP - 4185
EP - 4192
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 10
M1 - 9171556
ER -