High-resolution 3D printing magnetically-active microstructures using micro-CLIP process

Guangbin Shao, Henry Oliver T. Ware, Xiangfan Chen, Longqiu Li, Cheng Sun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations


Magnetic-driven micro-robotic devices have shown promising potential in enabling applications in micromanipulation, biosensing, targeted drug delivery, and minimally invasive surgery. However, the fabrication of miniaturized magnetic structures with complex geometries has remained the major technical obstacle. In this study, we report the development of a new magnetically-active photopolymerizable resin comprises poly (ethylene glycol) diacrylate monomer, Fe3O4 magnetic nanoparticles, photoinitiator, and other functional additives. Micro-continuous liquid interface production (micro-CLIP) 3D printing process was employed to realize high-resolution and high-speed fabrication of complex structures. The key characteristic properties of resin along with the matching process conditions were investigated experimentally, which allows for establishing the set of optimal fabrication conditions in fabricating magnetic microactuators towards potential applications.

Original languageEnglish (US)
Title of host publicationNano-, Bio-, Info-Tech Sensors and 3D Systems III
EditorsJaehwan Kim
ISBN (Electronic)9781510625938
StatePublished - 2019
Externally publishedYes
EventNano-, Bio-, Info-Tech Sensors and 3D Systems III 2019 - Denver, United States
Duration: Mar 4 2019Mar 6 2019

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceNano-, Bio-, Info-Tech Sensors and 3D Systems III 2019
Country/TerritoryUnited States


  • 3D printing
  • high-resolution
  • magnetic resin
  • micro-CLIP

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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