High crystalline-quality III-V layer transfer onto Si substrate

Peng Chen, Yi Jing, S. S. Lau, Dapeng Xu, Luke Mawst, Terry Alford, Charles Paulson, T. F. Kuech

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


In this study, an approach combining ion cutting and selective chemical etch for the transfer of high crystalline-quality III-V layers on Si O2 Si substrate has been investigated. This layer transfer scheme takes advantage of the ion-cutting process by conserving III-V substrates for reuse and simultaneously improving the transferred layer quality and surface condition without using chemical and mechanical polishing. The relocation of the ion-implantation damage maximum enables the transfer of relatively defect-free InP-based layers onto a Si substrate coated with an oxide layer and results in structures ready for further optoelectronic device fabrication or epitaxial growth.

Original languageEnglish (US)
Article number092107
JournalApplied Physics Letters
Issue number9
StatePublished - 2008

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)


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