Abstract
In this study, an approach combining ion cutting and selective chemical etch for the transfer of high crystalline-quality III-V layers on Si O2 Si substrate has been investigated. This layer transfer scheme takes advantage of the ion-cutting process by conserving III-V substrates for reuse and simultaneously improving the transferred layer quality and surface condition without using chemical and mechanical polishing. The relocation of the ion-implantation damage maximum enables the transfer of relatively defect-free InP-based layers onto a Si substrate coated with an oxide layer and results in structures ready for further optoelectronic device fabrication or epitaxial growth.
Original language | English (US) |
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Article number | 092107 |
Journal | Applied Physics Letters |
Volume | 92 |
Issue number | 9 |
DOIs | |
State | Published - 2008 |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)