Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales

Jingwei Bai, Deqiang Wang, Sung Wook Nam, Hongbo Peng, Robert Bruce, Lynn Gignac, Markus Brink, Ernst Kratschmer, Stephen Rossnagel, Phil Waggoner, Kathleen Reuter, Chao Wang, Yann Astier, Venkat Balagurusamy, Binquan Luan, Young Kwark, Eric Joseph, Mike Guillorn, Stanislav Polonsky, Ajay RoyyuruS. Papa Rao, Gustavo Stolovitzky

Research output: Contribution to journalArticlepeer-review

54 Scopus citations


We introduce a method to fabricate solid-state nanopores with sub-20 nm diameter in membranes with embedded metal electrodes across a 200 mm wafer using CMOS compatible semiconductor processes. Multi-layer (metal-dielectric) structures embedded in membranes were demonstrated to have high uniformity (±0.5 nm) across the wafer. Arrays of nanopores were fabricated with an average size of 18 ± 2 nm in diameter using a Reactive Ion Etching (RIE) method in lieu of TEM drilling. Shorts between the membrane-embedded metals were occasionally created after pore formation, but the RIE based pores had a much better yield (99%) of unshorted electrodes compared to TEM drilled pores (<10%). A double-stranded DNA of length 1 kbp was translocated through the multi-layer structure RIE-based nanopore demonstrating that the pores were open. The ionic current through the pore can be modulated with a gain of 3 using embedded electrodes functioning as a gate in 0.1 mM KCl aqueous solution. This fabrication approach can potentially pave the way to manufacturable nanopore arrays with the ability to electrically control the movement of single or double-stranded DNA inside the pore with embedded electrodes. This journal is

Original languageEnglish (US)
Pages (from-to)8900-8906
Number of pages7
Issue number15
StatePublished - Aug 7 2014
Externally publishedYes

ASJC Scopus subject areas

  • General Materials Science


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