Fabrication of flexible and stretchable highly conductive Ag-PDMS tri-layer interconnect and its integration into Li-ion pouch cells

Mayukh Nandy, Siyang Liu, Yanze Wu, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Devices of the 2stcentury have transformed from rigid handheld usage to their thin, flexible, and stretchable counterparts. Potential applications of such devices include soft robotics for gaming and virtual reality, sensors for body movement and health monitoring, flexible displays, and others. With this transition, the need for different components of such devices to be flexible has increased several folds. Such components should be able to conform to any shape while bending, flexing, or stretching while maintaining their mechanical integrity and electrical stability. Hence, reliability is of utmost importance. While energy storage research and application has already been witnessing a shift to high performance yet flexible Li-ion batteries, conventional rigid metal tabs continue to be used as interconnects becoming their failure point. Highly conductive fillers introduced into soft polymer matrix are often the chosen solution to design flexible and stretchable conductors to avoid a trade-off between mechanical and electrical requirements. In this work, a low-cost method to produce thin yet highly conductive flexible and stretchable interconnect is proposed. This thin interconnect can be batch fabricated for industrial applications. Extensive reliability testing is performed to assert its reproducibility and durability. The prepared interconnect is integrated into Li-ion pouch cell to study the effect of pouch sealing conditions on its mechanical and electrical properties and reversibly the effect of this novel interconnect on seal strength. In this paper, the design of the tri-layer interconnect and batch fabrication along with standalone and battery pouch integrated interconnect characterization and reliability testing methods are discussed in detail.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages450-453
Number of pages4
ISBN (Electronic)9798350334982
DOIs
StatePublished - 2023
Event73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States
Duration: May 30 2023Jun 2 2023

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2023-May
ISSN (Print)0569-5503

Conference

Conference73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/TerritoryUnited States
CityOrlando
Period5/30/236/2/23

Keywords

  • Battery
  • Composite materials
  • Conducting materials
  • Flexible electronics
  • Interconnect
  • Materials Reliability
  • Polymers

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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