TY - GEN
T1 - Electrically conductive adhesive (ECA) processing for shingled modules analyzed by x-ray imaging
AU - Hartweg, Barry
AU - Fisher, Kathryn
AU - Holman, Zachary
N1 - Funding Information:
This work was supported by the U.S. Department of Energy (DOE) under Contract No. DE-AC36-08GO28308 with Alliance for Sustainable Energy, LLC, the Manager and Operator of the National Renewable Energy Laboratory (NREL). NREL is a national laboratory of the DOE, Office of Energy Efficiency and Renewable Energy. Funding provided as part of the Durable Modules Consortiu978-1-7281-6115-0/20/$31.00 m (DuraMAT). ©2020 IEEE
Publisher Copyright:
© 2020 IEEE.
PY - 2020/6/14
Y1 - 2020/6/14
N2 - Electrically conductive adhesives (ECAs) are being used in several different PV module architectures, including shingled modules. Presently, there is limited available literature on the failure mechanisms of ECAs. X-ray imaging techniques can image a wider region than that of sample extraction for SEM imaging, while still retaining resolutions down to 0.5 µm/pixel. X-ray projections have been used to study the effect of different ECA application methods and curing conditions on the ECA in a shingled mini-module. It was found that lamination does not affect the ECA, if it has already been cured. Additionally, the cell lay-up step in the shingled module fabrication was found to be the primary cause of voids in the ECA layer.
AB - Electrically conductive adhesives (ECAs) are being used in several different PV module architectures, including shingled modules. Presently, there is limited available literature on the failure mechanisms of ECAs. X-ray imaging techniques can image a wider region than that of sample extraction for SEM imaging, while still retaining resolutions down to 0.5 µm/pixel. X-ray projections have been used to study the effect of different ECA application methods and curing conditions on the ECA in a shingled mini-module. It was found that lamination does not affect the ECA, if it has already been cured. Additionally, the cell lay-up step in the shingled module fabrication was found to be the primary cause of voids in the ECA layer.
KW - ECA
KW - shingled module
KW - x-ray imaging
UR - http://www.scopus.com/inward/record.url?scp=85099591357&partnerID=8YFLogxK
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U2 - 10.1109/PVSC45281.2020.9300776
DO - 10.1109/PVSC45281.2020.9300776
M3 - Conference contribution
AN - SCOPUS:85099591357
T3 - Conference Record of the IEEE Photovoltaic Specialists Conference
SP - 340
EP - 341
BT - 2020 47th IEEE Photovoltaic Specialists Conference, PVSC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 47th IEEE Photovoltaic Specialists Conference, PVSC 2020
Y2 - 15 June 2020 through 21 August 2020
ER -