Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects

Brahim Bensalem; James Aberle

doi:10.1109/EPEPS.2018.8534271

Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Substrate integrated waveguides (SIWs) are a viable interconnect solution for ultra-high-speed digital channels. Here, we perform design of experiment evaluation of SIW with respect to material and manufacturing variations. We generate physical model using response surface method. Variability sources are identified and the model provides tools for the designer to minimize variability and optimally center the design. A typical full channel leveraging optimal solution is shown to achieve better than 7.0 GHz bandwidth, a total of BER of nearly 0 at 100 Mbps rate and an EVM of 2.1% or less.

Original language	English (US)
Title of host publication	EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	83-85
Number of pages	3
ISBN (Electronic)	9781538693032
DOIs	https://doi.org/10.1109/EPEPS.2018.8534271
State	Published - Nov 13 2018
Event	27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018 - San Jose, United States Duration: Oct 14 2018 → Oct 17 2018

Other

Other	27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018
Country/Territory	United States
City	San Jose
Period	10/14/18 → 10/17/18

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

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10.1109/EPEPS.2018.8534271

Cite this

Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects. / Bensalem, Brahim; Aberle, James.
EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. p. 83-85 8534271.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Bensalem, B & Aberle, J 2018, Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects. in EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems., 8534271, Institute of Electrical and Electronics Engineers Inc., pp. 83-85, 27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018, San Jose, United States, 10/14/18. https://doi.org/10.1109/EPEPS.2018.8534271

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Effects of Manufacturing Variations on Ultra-High-Speed Integrated Waveguide Memory Interconnects

Abstract

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