Abstract
Interfacial fatigue cracks were propagated in Cu/sapphire bicrystals with effect of anisotropy and slip geometry in the fracture process. Compact tension specimens with two different crystallographic crack growth directions were loaded to ΔKla ≃ 2 Mpa m1/2 with R*0. Interfacial cracks grew preferentially along <110>Cu and less favorably along <001>Cu. Large areas of the copper fracture surface were relatively featureless for crack growth along <110>Cu, whereas well defined striations could be observed for the second direction. A refined elastic analysis of the anisotropic near-tip fields for the interfacial crack revealed that the preferential crack growth direction had the highest energy release rate and mode I crack tip opening displacement. The second direction corresponded to a minimum mode II mix. Similar correlations were found in other Cu/sapphire bicrystal experiments described in the literature. Dislocation nucleation from the interfacial crack tip is also analyzed.
Original language | English (US) |
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Pages (from-to) | 55-66 |
Number of pages | 12 |
Journal | Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing |
Volume | 314 |
Issue number | 1-2 |
DOIs | |
State | Published - Sep 15 2001 |
Keywords
- Anisotropy
- Compact tension
- Cu/sapphire bicrystal
- Interfacial crack
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering