Effect of intermetallic compounds on the thermomechanical fatigue life of three-dimensional integrated circuit package microsolder bumps: Finite element analysis and study

Engineering & Materials Science

• Three dimensional integrated circuits 66%
• Intermetallics 50%
• Soldering alloys 35%
• Fatigue of materials 32%
• Finite element method 29%
• Volume fraction 16%
• Cyclic loads 7%
• Short circuit currents 5%
• Plastic deformation 5%
• Mechanical properties 3%
• Geometry 3%
• Experiments 2%

Chemical Compounds

• Thermomechanical Fatigue 100%
• Intermetallic Compound 51%
• Solder 44%
• Strain 12%
• Mechanical Fatigue 11%
• Volume 10%
• Short Circuit 6%
• Drop 5%