@inproceedings{c0cbcca37d084afeb1dc3b3d29c89ee2,
title = "Dynamics of Crack Propagation during Silicon Spalling",
abstract = "Spalling has been proposed as a promising kerfless technique for slicing thin silicon wafers and thus double the yield of a silicon ingot. The main challenge of spalling is to control the roughness and thickness variation of the spalled wafers, that can be as high as 100% of the wafer thickness. We have shown that these thickness variations are largely influenced by the interaction of the crack front with reflected waves at the edges and the stress field applied at the crack tip. In this paper, we provide the necessary information to fully understand the origin of the surface roughness caused by the interaction of the reflected waves with the crack front. These new insights of the crack dynamics can pave the way to attain full control on the surface quality of the spalled wafer.",
keywords = "Spalling, crack dynamics, crack propagation, kerfless, reflected waves, silicon",
author = "Coll, {Pablo Guimera} and Rico MEIER and Mariana Bertoni",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 ; Conference date: 10-06-2018 Through 15-06-2018",
year = "2018",
month = nov,
day = "26",
doi = "10.1109/PVSC.2018.8548314",
language = "English (US)",
series = "2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "2537--2539",
booktitle = "2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC",
}