@article{31fc70d6fd114c6aaa97b466eff55987,
title = "Copper-based metallization and interconnects for ultra-large-scale integration applications",
author = "Terry Alford and Jian Li and Mayer, {James W.} and Wang Shi-Qing",
note = "Copyright: Copyright 2018 Elsevier B.V., All rights reserved.",
year = "1995",
month = jun,
day = "15",
doi = "10.1016/0040-6090(95)06624-1",
language = "English (US)",
volume = "262",
pages = "vii,viii",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "1-2",
}