Compact modeling for RF and microwave integrated circuits

A. M. Niknejad; M. Chan; C. Hu; B. Brodersen; X. Xi; J. He; S. Emami; C. Doan; Y. Cao; P. Su; H. Wan; M. Dunga; C. H. Lin

Compact modeling for RF and microwave integrated circuits

A. M. Niknejad, M. Chan, C. Hu, B. Brodersen, X. Xi, J. He, S. Emami, C. Doan, Y. Cao, P. Su, H. Wan, M. Dunga, C. H. Lin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling, and active devices.

Original language	English (US)
Title of host publication	2003 Nanotechnology Conference and Trade Show - Nanotech 2003
Editors	M. Laudon, B. Romanowicz
Pages	294-297
Number of pages	4
State	Published - 2003
Externally published	Yes
Event	2003 Nanotechnology Conference and Trade Show - Nanotech 2003 - San Francisco, CA, United States Duration: Feb 23 2003 → Feb 27 2003

Publication series

Name	2003 Nanotechnology Conference and Trade Show - Nanotech 2003
Volume	2

Other

Other	2003 Nanotechnology Conference and Trade Show - Nanotech 2003
Country/Territory	United States
City	San Francisco, CA
Period	2/23/03 → 2/27/03

Keywords

Interconnect modeling
Passive device modeling
RF and microwave compact modeling
Substrate coupling

ASJC Scopus subject areas

General Engineering

Cite this

Niknejad, A. M., Chan, M., Hu, C., Brodersen, B., Xi, X., He, J., Emami, S., Doan, C., Cao, Y., Su, P., Wan, H., Dunga, M., & Lin, C. H. (2003). Compact modeling for RF and microwave integrated circuits. In M. Laudon, & B. Romanowicz (Eds.), 2003 Nanotechnology Conference and Trade Show - Nanotech 2003 (pp. 294-297). (2003 Nanotechnology Conference and Trade Show - Nanotech 2003; Vol. 2).

Compact modeling for RF and microwave integrated circuits. / Niknejad, A. M.; Chan, M.; Hu, C. et al.
2003 Nanotechnology Conference and Trade Show - Nanotech 2003. ed. / M. Laudon; B. Romanowicz. 2003. p. 294-297 (2003 Nanotechnology Conference and Trade Show - Nanotech 2003; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Niknejad, AM, Chan, M, Hu, C, Brodersen, B, Xi, X, He, J, Emami, S, Doan, C, Cao, Y, Su, P, Wan, H, Dunga, M & Lin, CH 2003, Compact modeling for RF and microwave integrated circuits. in M Laudon & B Romanowicz (eds), 2003 Nanotechnology Conference and Trade Show - Nanotech 2003. 2003 Nanotechnology Conference and Trade Show - Nanotech 2003, vol. 2, pp. 294-297, 2003 Nanotechnology Conference and Trade Show - Nanotech 2003, San Francisco, CA, United States, 2/23/03.

@inproceedings{7fade27d7d6d4dc3a82953d5ce091a7f,

title = "Compact modeling for RF and microwave integrated circuits",

abstract = "Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling, and active devices.",

keywords = "Interconnect modeling, Passive device modeling, RF and microwave compact modeling, Substrate coupling",

author = "Niknejad, {A. M.} and M. Chan and C. Hu and B. Brodersen and X. Xi and J. He and S. Emami and C. Doan and Y. Cao and P. Su and H. Wan and M. Dunga and Lin, {C. H.}",

year = "2003",

language = "English (US)",

isbn = "0972842209",

series = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003",

pages = "294--297",

editor = "M. Laudon and B. Romanowicz",

booktitle = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003",

note = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003 ; Conference date: 23-02-2003 Through 27-02-2003",

}

TY - GEN

T1 - Compact modeling for RF and microwave integrated circuits

AU - Niknejad, A. M.

AU - Chan, M.

AU - Hu, C.

AU - Brodersen, B.

AU - Xi, X.

AU - He, J.

AU - Emami, S.

AU - Doan, C.

AU - Cao, Y.

AU - Su, P.

AU - Wan, H.

AU - Dunga, M.

AU - Lin, C. H.

PY - 2003

Y1 - 2003

N2 - Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling, and active devices.

AB - Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling, and active devices.

KW - Interconnect modeling

KW - Passive device modeling

KW - RF and microwave compact modeling

KW - Substrate coupling

UR - http://www.scopus.com/inward/record.url?scp=6344240669&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=6344240669&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:6344240669

SN - 0972842209

SN - 9780972842204

T3 - 2003 Nanotechnology Conference and Trade Show - Nanotech 2003

SP - 294

EP - 297

BT - 2003 Nanotechnology Conference and Trade Show - Nanotech 2003

A2 - Laudon, M.

A2 - Romanowicz, B.

T2 - 2003 Nanotechnology Conference and Trade Show - Nanotech 2003

Y2 - 23 February 2003 through 27 February 2003

ER -

Compact modeling for RF and microwave integrated circuits

Abstract

Publication series

Other

Keywords

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this