CMOS bi-directional ultra-wideband galvanically isolated die-To-die communication utilizing a double-isolated transformer

Keyphrases

• Ultra-wideband 100%
• Communication Channels 100%
• Galvanically Isolated 100%
• Isolated Transformer 100%
• Die-to-Die Communication 100%
• Cost Reduction 50%
• Transceiver 50%
• Time of Use 50%
• Design Methodology 50%
• Fabrication Methods 50%
• Low Power 50%
• Transceiver Architecture 50%
• Power Consumption 50%
• System Use 50%
• Proposed Design 50%
• Coupled Channels 50%
• Bond Wire 50%
• Silicon Area 50%
• Cost Factors 50%
• Connected in Series 50%
• Art Performance 50%
• CMOS Fabrication 50%
• Propagation Delay 50%
• Channel Capacity 50%
• Transformer-2 50%
• Magnetically Coupled 50%
• Transformer Coupled 50%
• Assembly Cost 50%
• Consumption Delay 50%
• Bipolar-CMOS-DMOS (BCD) Process 50%
• Galvanic Isolator 50%
• Odd Symmetry 50%
• Time Division Duplex 50%
• Transient Immunity 50%
• Broadband Pulses 50%
• Power Propagation 50%
• High Voltage Isolation 50%
• Center-tapped Transformer 50%
• Noise Transients 50%
• Pulse Polarity 50%

Engineering

• Directional 100%
• Ultra-Wideband 100%
• Transceiver 66%
• Communication Channel 66%
• Cost Reduction 33%
• Transients 33%
• Electric Power Utilization 33%
• Isolators 33%
• Channel Capacity 33%
• Propagation Delay 33%
• Division Duplex 33%
• Assembly Cost 33%