Case study: Applying data mining to defect diagnosis

M. C. Jothishankar, Teresa Wu, Johnie Roberts, Jiun Yan Shiau

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


One of the defects during the re-flow soldering in printed circuit boards is the defect of tombstone. It is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by several factors. In this paper, a description of the problem is presented with the factors that cause tombstones. Data mining approaches are presented to identify the factors that are significant. Data was collected over a period of one year to study this problem. Results are presented with suggested improvements.

Original languageEnglish (US)
Pages (from-to)69-83
Number of pages15
JournalJournal of Advanced Manufacturing Systems
Issue number1
StatePublished - Jun 1 2004


  • Data mining
  • Defect diagnosis
  • Quality control
  • Tombstones

ASJC Scopus subject areas

  • Computer Science Applications
  • Strategy and Management
  • Industrial and Manufacturing Engineering


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