Abstract

Metal-semiconductor-field-effect-transistors (MESFETs) have been fabricated using a 150 nm partially depleted silicon-on-insulator CMOS technology. A peak f T of 40 GHz and peak breakdown voltages of up to 12V were measured. Comparatively, the CMOS transistors on the same process have a maximum steady-state voltage limit of 1.95V. TOM3 model for MESFET developed in ADS. The demonstrated high cut-off frequency and high voltage operation capability make the SOI MESFET a good device candidate for integrated radio frequency (RF) power amplifiers (PA). A cascoded MOS-MES RF PA architecture is proposed and simulated in ADS using the TOM3 model. Simulation results show 75% PAE while delivering 24dBm output power.

Original languageEnglish (US)
Title of host publicationEuropean Microwave Week 2011
Subtitle of host publication"Wave to the Future", EuMW 2011, Conference Proceedings - 6th European Microwave Integrated Circuit Conference, EuMIC 2011
Pages316-319
Number of pages4
StatePublished - Dec 1 2011
Event14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 6th European Microwave Integrated Circuit Conference, EuMIC 2011 - Manchester, United Kingdom
Duration: Oct 10 2011Oct 11 2011

Publication series

NameEuropean Microwave Week 2011: "Wave to the Future", EuMW 2011, Conference Proceedings - 6th European Microwave Integrated Circuit Conference, EuMIC 2011

Other

Other14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 6th European Microwave Integrated Circuit Conference, EuMIC 2011
Country/TerritoryUnited Kingdom
CityManchester
Period10/10/1110/11/11

Keywords

  • MESFETs
  • Power Amplifiers (PA)
  • silicon-on-insulator (SOI)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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